Cloud-Based PCB Module Analysis Platform : the New Super Tool for the PCB Industry in Taiwan

CONTRIBUTING TEAM：Ming-Hsiao Lee, Jiun-Horng Lee, Jen-Gaw Lee, Chih-Min Yao

In contemporary industrial fields, technology is rapidly evolving, with functionalities becoming increasingly advanced and diverse, while the structures and compositions of devices grow ever more complex. This is particularly evident in the case of printed circuit boards (PCBs), which plays a key role in electronic equipment. The primary challenge to tackle is effectively and efficiently analyzing, making adjustments, and swiftly identifying the optimal solution. NCHC has developed the cloud-based PCB Analysis Platform (Web-PCBA) to assist designers in rapidly and precisely evaluating structural stresses and warpages, consequently enhancing product quality.



In recent years, the importance of the electronics industry in Taiwan has attracted global attention, primarily because of the strong technical expertise of manufacturers and their ability to keep up with the times and the market trends, and PCB is one of the most representative fields. Throughout the PCB manufacturing process, issues like structural warpage and solder ball failures may arise, stemming from various factors. One contributing factor is the difference in thermal expansion coefficients among the stacked and composed materials. This can result in warping deformation of the PCB unit and panel due to differential shrinkage during the cooling process from high temperatures to room temperature. Moreover, during the operation of electronic equipment, the cyclic temperature fluctuations experienced by the solder ball can lead to warping and deformation, ultimately impacting its service life. Therefore, in practice it is necessary to go through the standard test of the temperature rise and fall process to evaluate whether the life of the solder ball meets the requirements. Hence, effectively monitoring the quality of manufactured products in alignment with the design specifications is a crucial challenge that companies in the industry must address promptly and efficiently.

The trigger behind the development of Web-PCBA stems from leveraging NCHC's powerful computing capabilities to aid R&D personnel in both industry and academia with swift and precise evaluations of structural deformations. Traditionally, addressing structural analysis challenges required professional engineers to utilize specialized software for complicate simulations, a process demanding significant time and effort. Our platform's functionalities automate the conversion of electronic circuit diagrams, streamline warpage analysis, optimize copper distribution, assess placement combinations of modules on the panel, evaluate solder ball fatigue life, analyze the impact of shielding frames on warpage deformations, and optimize chip placement.

In order to significantly streamline the simulation process and enhance user-friendliness, the platform builds the finite element model automatically and integrates powerful simulation software such as ANSYS, ABAQUS, or open-source code Calculix.
 
PCB warpage analysis

Through the web interface, users can quickly input or select parameters related to geometry, material, and other structural parameters, and the platform can automatically generate stress and deformation distribution maps. It’s also highly customizable, enabling users to adjust the model design and report content according to their needs. Meanwhile, the cloud-based design enables users to access the platform using networked devices, facilitating analysis and review of results from any location and at any time, thereby significantly enhancing work convenience. Considering the information security, this platform implements stringent IP and account permission management to safeguard the privacy and security of user data.



Solder ball fatigue life simulation analysis

Web-PCBA is an innovative tool to elevate product value and competitive advantage. This platform has strengthened the mechanical analysis capabilities of the industry in Taiwan. Currently, there are already cooperations between major semiconductor packaging companies and NCHC. Since such companies not only engage in contract manufacturing but also have product development needs, they leverage the highly customized analysis provided by this platform to optimize the efficiency of their product development efforts. In the future, we aim to continuously leverage our expertise in solid mechanics and high-performance computing to further broaden collaboration opportunities and develop platforms tailored to the diverse needs of various R&D organizations. Through these endeavors, NCHC will emerge as a strong supporter of the domestic industry-academia community.