IMPACT Conference 2010-Call for Paper High Exposure by Collected in IEEE Xplore 2010/03/30
Being the most remarkable international technology conference in packaging, thermal, assembly and PCB areas, IMPACT 2010 has launched into call for paper till June 11. Please seize the opportunity to join the international event.
Following the four-year experiences and achievements, the 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference in conjunction with TPCA Show 2010 will take place in Taipei Nangang Exhibition Center during October 20 to 22, 2010. In the past two years, IMPACT got the excellent records with more than 190 papers presented in the conference and attendees from 17 nations. With the theme of “Embrace IMPACT, Create Possibilities”, IMPACT is striving to work out the advanced paper scope and reward policy to attract outstanding papers from the world. It aims to become the representative international technology conference of packaging, thermal, assembly and PCB field both in industry and academic areas. In the meantime, all IMPACT papers would be referred in IEEE Xplore with high exposure rate.
Taking the advantage of resources from industry, academic and research institute, IMPACT is organized by IEEE CPMT-Taipei, IMAPS-Taiwan, ITRI, National Tsing Hua University, SIPO and TPCA and co-organized by TTMA, I-Shou University, SMTA and Taiwan PCB Institute. The paper scope would be divided in to Microsystems, Packaging, Thermal Technology and PCB & Assembly Technology. In the former scope, it includes Advanced Packaging, Modeling & Simulation, interconnection & Nanotechnology and Thermal Management. Especially, 3D IC, TSV Connection and LED Packaging are the popular items in 2010. In the latter scope, Materials & Process, Inspection & Reliability, Electrochemical Processing and HDI are the main items. In addition, papers relative to Green Technology and Mechatronics & Automation are welcome to join IMPACT.
The award policy is implemented since the 1st IMPACT. Outstanding Paper Award and Best Student Paper Award in Packaging and PCB areas accordingly will be honored in award ceremony. In order to encourage students to contribute into PCB industry after graduation, the co-organizer, Taiwan PCB Institute sponsors the Outstanding PCB Thesis Award with a great prize.
Now, IMPACT is in the step of call for paper. The deadline of abstract submission is June 11, 2010. Besides that, IMPACT arranges varied sponsorships which go with high advertisement benefits. Welcome papers and sponsors to join this international event.
More information about IMPACT 2010, please refer to the conference website, www.impact.org.tw , or contact with secretariat, MS. Sylvia Yang(email@example.com).
Welcome download 2010 IMPACT call for paper e-DM